TeoSys Engineering LLC

TeoSys Inscription on Glass Micromachining Channels in Stainless using 532nm 2 Micron Spot Size in UV Laser Ablation of Zinc Sulphide UV Laser Cutting of Wire Mesh into 295um Disc UV Laser Wire Stripping 2D Barcoding on Pinhead UV Laser Drilling of Glass Disc IR Laser Inscription into Brass using 1064nm Galvo Motion Aluminum Ablation from Glass Substrate using UV Excimer Laser Ablation

TeoSys Engineering LLC

Laser Micromachining Systems & Contract Services

Great Turnaround Times and special deals for UV Hole Drilling this September!!!

Home Search Contact Info About TeoSys

 Custom Laser Systems, Laser Drilling, Laser Marking, Laser Cutting, Laser Etching, Laser Milling, Laser Stripping   Sales:sales@teosys.com

 

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CUSTOM SYSTEMS  -  Industrial Micromachining & Laser Marking Systems

TeoSys Engineering is a fully integrated laser systems designer, manufacturer and contract services provider.  We specialize in the laser micromachining of difficult materials (plastics, glass, diamond, etc.) with feature sizes as small as 1 micron using excimer lasers.  TeoSys also offers complete UV systems with pricing starting as low as $65K.  That includes micron accurate motion (2 axis automatic - focus is manual, UV laser, beam delivery, and custom software for integrated control of laser and motion). 

TeoSys produces the worlds smallest, lowest cost, complete (and portable) Ultraviolet Excimer laser micromachining system.

Custom System for Automatic Laser Hole Drilling          CO2 Laser Inscription System

Our core laser micromachining systems are rapidly prototyped based on customer application requirements thereby reducing lead-time and cost.

Micromachining Contract Services - Great UV Drilling Turnaround Times

TeoSys offers custom contract services in laser cutting, laser drilling and laser marking.  We can laser mark any text, graphics,1 and 2-D barcodes.  Our text is as small as 10 microns in character height.  Our spot sizes are as small as 1 micron.  Our laser systems range from fully automated 5-axis systems to semi-automated 2 axis.

       

Our patented intra-cavity aperture (ICVA) design in our excimer lasers improves beam quality with near TM00 performance.  The ICVA extends optical longevity, maximizes useable energy density (fluence) to the work surface and increases machinable depth of field by over 2 orders of magnitude.  Other UV lasers use external devices to shape and trim the laser beam causing premature system wear and limited UV depth of field.  In addition, our ICVA system allows the user to dynamically adjust the beam size during laser firing.

CUSTOM SOFTWARE  -  Integrated Laser, Motion & Measurement

Incredibly seamless integration of laser, motion system and in-process measurement that provides the best control of all laser micromachining processes whether hole drilling in metals, text inscribing in glass and diamond, or channel drilling in polyimide and Kalrez.

 TeoSys 10 Micron UV Text Inscription on Borofloat Green Laser 532nm Custom Software for Hole Drilling Laser DRilling of Channels in Metal Using 532nm & Measurement

CUSTOM Fixturing  -  Integrated Motion and Part Movement

In-House Machine Shop & Fabrication for Quick Turnaround  (Micro and Macro)

In addition to our 'micro' fabrication services we offer a complete range of 'macro' fabrication services.  We have a complete shop on-site which includes mills, lathes and metrology equipment.  Parts fabrication and custom parts design and fabrication are provided.

 

 

Sales: sales@teosys.com

Customer Support: teosys@teosys.com  

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Last modified: September 16, 2008