TeoSys Laser Inscription on Glass Micromachining Channels in Stainless using 532nm 2 Micron Spot Size in UV Laser Ablation of Zinc Sulphide UV Laser Cutting of Wire Mesh into 295um Disc UV Laser Wire Stripping 2D Barcoding on Pinhead UV Laser Drilling of Glass Disc Aluminum Ablation from Glass Substrate using UV Excimer Laser Ablation

TeoSys Engineering LLC

Laser Micromachining Systems & Contract Services

Great Turnaround Times and special deals for UV Hole Drilling this Quarter!!!

Home Search Contact Info About TeoSys

 Custom Laser Systems, Laser Drilling, Laser Marking, Laser Cutting, Laser Etching, Laser Milling, Laser Stripping   Sales:sales@teosys.com

 

Home
Contract Laser Services
Excimer Lasers (OEM)
Laser Systems
'Macro' Fabrication
Laser Applications
Engineering Services
Downloads
TeoSys Employment

 
OEM Excimer Lasers   (Laser Systems) (Laser Machining Services)
 

T200 UV Pulsed Excimer Laser with Intra Cavity Variable Aperture System (QUOTE)

Our more powerful T200 excimer laser is an extremely compact solution available for integration into any system for those requiring custom packaging.  The T200 is the best in affordable excimer laser technology.  The laser comes with everything needed to integrate into an existing system.  TeoSys also offers standard laser micromachining systems and specialized in the development of custom laser systems according to customer specifications.

 
  • 157nm/193nm/248nm Wavelengths
  • 1 - 500 Hz repetition rate range
  • 16 mJ Max Pulse Energy, 12 mJ Typical @ 193nm and depending on repetition rate (call for other wavelengths) (Our 248nm laser can reach 30 mJ at 100 Hz.)
  • <8ns pulse width
  • Ceramic / Metallic construction (no plastics)
  • Integrated microprocessor laser control
  • Automated (computer controlled) gas fill system
  • Proprietary Dual blower system that minimizes vibration transmitted to other components of system.  Provides excellent beam stability with high rep rate performance.
  • Voltage and thermal monitoring system
  • Patented intra-cavity gain / beam control
  • Clean room compatibility
  • Compact/desktop design
     

        

          

Exclusive Patented Intra-Cavity Aperture System that provides Near TM00 beam quality. 

The ICVA produces a circular gaussian beam with an extremely long depth of field.  The ICVA is ideal for thick material drilling since it produces straighter walls, rounder holes, with better consistency when compared with traditional extra cavity system.

The ICVA also dramatically extends laser optics lifetime by limiting resonator gain to exactly that required to get the job done.  All other UV lasers use external devices to shape and trim the laser beam causing premature system ware, burnt apertures, and limited UV depth of field.

The ICVA system allows the user to dynamically adjust beam size DURING LASER FIRING.  Most other system requires extensive manipulation of the external optics to manipulate beam size and energy.  The T200 is the only system that provides this real-time adjustment capability.

The ICVA also provides superior beam stability and longevity over time.  The ICVA specifically provides exceptional beam quality regardless of electrode wear.  Unlike other laser systems were external apertures and optics are used to compensate for non-symmetrical beams, the T200 with ICVA does not change divergence or beam quality over time.  This is a significant advantage that minimizes maintenance guarantees stable performance over the entire life of the laser head

                   

T20 UV Pulsed Excimer Laser with Intra Cavity Variable Aperture System

Our T20 excimer laser is a an solution for those whose requirements which allow for a less powerful and more compact OEM excimer laser.  As with the T200 laser, the T20 is available at many different wavelengths.  Below outlines the specifications for the 193nm wavelength.  Please call for specifications for other wavelengths.

  • 157nm/193nm/248nm Wavelengths
  • 1 - 35 Hz repetition rate range
  • 8 mJ Max Pulse energy @ 193nm (call for other wavelengths)
  • <8ns pulse width
  • Ceramic / Metallic construction (no plastics)
  • Patented intra-cavity infinitely variable aperture beam contro

Background

Excimer Lasers (OEM)

All of our Excimer lasers are designed, manufactured and serviced in house.  Because we design our own lasers, we are better able to integrate the laser into the system thereby optimizing performance for the application and reducing overall system cost.  Our excimer lasers are small and compact but still deliver the power and repetition rate required by many excimer jobs.

Excimer lasers generate a light beam through production of an excited dimer, or two atom gas molecule. The dimers utilized in excimer lasers are composed of rare gas and halogen atoms, e.g., krypton fluoride, xenon fluoride, argon fluoride, xenon chloride. The choice of gas mixture used in the laser determines the dimer that is formed and wavelength of the ultraviolet laser light.  Other wavelengths can be derived from solid and gas state lasers. 

Excimer Lasers  - Excimer lasers have short wavelengths, short pulse durations, high intensities and operate in the ultraviolet part of the spectrum.  They are gas lasers combining of rare gases (argon, krypton and xenon), a halide (usually fluorine) and an inert gas (helium or neon).  The specific wavelength is determined by the combination of gas mixture.

Most materials absorb light more strongly as the laser optical wavelength decreases. For example, at the ArF laser wavelength deep in the ultraviolet, oxygen absorbs the laser photons and even air becomes weakly attenuating.  Many polymers, crystals and metals that are either highly transmissive or highly reflective at infrared and visible wavelengths For example, borosilicate glass, polyurethane, or silver – absorb strongly in the ultraviolet. This allows ultraviolet lasers to be used in cutting applications that are unsuitable for longer wavelength sources.  Some materials show dramatic changes in absorption even within the ultraviolet.

The figure below shows the absorption depth of PMMA at three excimer laser wavelengths.  Between the ArF and XeF wavelengths the absorption depth of PMMA changes by a factor of 100.  At the longer 351 nm wavelength this material requires high laser power for cutting, and the quality of the cut is poor.  At 193 nm the same material cuts cleanly with significantly reduced power requirements.

 

  • materials processing and micromachining (hole drilling, etching, marking, deposition, annealing)
  • marking - both direct write and mask projection
  • surface ablation (low heat affected zone)
  • micromachining and medical device manufacturing

Excimer Laser Technology for Marking

The 193nm Excimer laser ablates a mark on the material in a ‘cold’ process.  This process does not appreciably affect the area around the mark.  In the picture below one can see that the surrounding material shows little sign of thermal stress after exposure to laser energy.

 
 Laser Drilled Hole in Ceramic
 

With most other lasers the area of thermal stress is nearly as large as the mark itself.  Having said this, the 193nm Excimer is not completely free from thermal effects.  One must be careful in overlapping marks at the same point, near or on a fractured area.  It is possible to initiate a crack, or enlarge a crack with excessive energy, and extended laser duration with some stones.  

TeoSys's Support of Systems Containing PL1500A Lasers

TeoSys has the capability of servicing and supporting the customers who have previously purchased Potomac Photonic's PL1500 or PL1500A excimer lasers. 

Although we are unauthorized by Potomac Photonics we have had a successful track record of servicing the lasers and systems that Potomac has delivered and is no longer interested in supporting.  We have retrofitted systems in the field with our T200 laser and an adaptation kit to allow our laser to communicate with the LMT4500 or LMS 2000 laser systems.

TeoSys is in no way affiliated with Potomac Photonics, Inc. 

 

Sales: sales@teosys.com
Customer Support: teosys@teosys.com

 
Send mail to teosys@teosys.com with questions or                     
comments about this web site.  Copyright © 2006 TeoSys Engineering
Last modified: October 10, 2008