Laser Micromachining Systems & Contract Services
Laser Micromachining Contract Services (Custom Laser Systems)
We perform precision micro milling, marking, stripping, drilling, and cutting on all hard to process materials. We also have a full capability machine shop on-site and are able to provide fabrication of larger pieces, micromachining of small features on the piece and quick turnaround for difficult micromachining part handling.
Take a look at examples of our work below!!
Examples of the materials on which we process: Plastics, Ceramics and Glass.
Polyimide (Kapton) (Kalrez) Polyurethane PTFE Teflon PEBAX Polystyrene Parylene
Alumina Zirconia Silicon Carbonate Pyrex Glass Borofloat Borosilicate
Diamond Quartz Fused Silica All colored gemstones
Steel Stainless Steel Nickle (Mu-metal) Brass Other Metals
Laser Micro Marking
Laser marking (direct write) of a 2D barcode on the bezel of a miniature microphone. Barcode is laser marked using a 2 micron spot size and is 50 microns square.
Laser direct write of a 2D barcode on the head of a stainless pin.
Laser Groove, Channel and Hole Drilling
Laser hole drilling in a custom catheter for medical applications.
Hole array drilling into stainless. The example below on the left is an array of 250 um holes drilled into 303 stainless steel. The next picture is an 81.7um hole drilled through a silicon wafer. An array of 16 micron holes is drilled in a Teflon tube with some 80 micron holes drilled below. These holes only go through one side of the tube. The picture to the far right is a 3 micron hole drilled in a glass substrate using an excimer laser at 193nm.
The picture below (left) is a 25 micron exit hole in 38micron thick stainless steel. We have full video microscope verification of feature size. TeoSys includes a copy of this feature size verification with the fabricated product for quality control purposes. The right picture below shows our calibration slide used to correlate our video microscope to our in process drilling video.
Below is a 38um thick kapton sheet which has a profiled hole drilled with a 120um entrance (on bottom) and a 30um exit (on top). Our video microscope provides feature measurement capabilities.
Below is a 62 micron hole lightly drilled through a polyurethane substrate.
In process groove drilling in 5 inch diameter pyrex plate. Groove is 150um deep and 255um wide. Although processing time was multiple hours, the 193nm wavelength provided clean groove walls and groove floor flatness for this unusual and very large piece.
TEFLON (PTFE) capillary tube - 30 um hole drilled at 193 nm through 1 mil wall thickness. This is one of the most difficult materials to micromachine. TeoSys was able to machine this material because our laser's superior beam quality, high energy density (fluence) and extensive experience with 193nm wavelength. Also shown is a polymer tube hole with a 50 micron hole.
Micro Stripping & Laser Ablation
Aluminum ablation using a UV Excimer laser. Note the beautiful individual spots (16 microns in diameter) that are achieved with an excimer laser running at 193nm. (bottom left). The middle picture depicts 5 microns of teflon ablated from around the circumference of a 15 micron diameter copper wire. An energy study is performed by looking at the effects of ablating zinc sulphide from a glass substrate using a UV Excimer laser at 193nm (bottom right).
Laser Ablation: 10 micron metal alloy coating ablated from a 6 micron circular area on glass.
Laser Ablation: 1.27 micron wide strip of a metal alloy laser ablated from glass surface.
Laser Ablation Study: We perform studies to determine our laser energy effect on the work surface. Below illustrates one such study with the strips on the right being the best energy and machining characteristics for the job.
Laser Marking (Visible)
Laser marking of parts for identification and serialization. Infrared wavelengths are used to mark the larger visible marks on products. Below shows marking on stainless, plastic and slate.
2D Data Matrix Barcode Marking
Data Matrix 2D barcodes laser marked using mask projection with a metal mask inside the laser cavity on rough DIAMOND at 50X magnification. The barcode is 30 microns square. This mask was machined at 1mm using the same laser system that later performed the intra-cavity mask projection. This mask is imaged from inside the laser as opposed to a contact mask which is placed on the work surface.
Increasing laser energy on a mask projection application. Laser energy increases from 30% on the far left to 90% on the far right. Picture taken at 20X magnification. The entire barcode is 20 microns high. On the right is the mask which was micromachined out of POLYIMIDE at 1mm. The reason that we could use polyimide was the fact that our mask is placed inside of the laser cavity (patented process) and this causes very little or no damage to the mask. Unlike extra-cavity mask projection lasers which tend to destroy the mask as they are using it. The outer part of the square is laser marked using a direct write process.
The above are examples of a subset of the contract services provided by TeoSys Engineering. Whatever your requirements, our team of applications engineers can implement a solution. Please call or e-mail (firstname.lastname@example.org) with your application needs.
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